Mems Films Fracture Strength Test On-Line

The dimension of MEMS devices ranges from several microns to a few hundred microns. In the past, mainly characteristics of macro and micro material have been well researched, but so far there has been few investigate parameters about microstructure. The mechanical properties of micromachined depend not only on the material used but also on the size and the shape of the microelement. To achieve good accuracy in characterizing the mechanical properties of a microelement in a MEMS applications. Process control during production requires small test structures can be test on line. In this article we investigate fracture strength of MEMS films.?The difficulties of fracture strength of MEMS thin film lie in test and how loads are applied. A good test structure not only predigests measurement, but also increases precision of measurement. So the measurement of material fracture strength essentially depends on the design of test structure. Chap 1 serves as an overview the development of MEMS in recent years, in addition, analyze the importance of the investigate material properties. Chap 2 following a global introduction of test methods for fracture strength, several typical test structures are introduced and compared. Chap 3 discusses in depth the improvement and design of test structure, and setup theory molding correspond to the test structure, the modeling is verified by COVENTOR and ANSYS software at last. Chap 4 presents the process of test structures and the manufacturing wafer. Chap 5deals with the development of test software. This article ends with a summary of my work.