Font Size: a A A

The Research And Implementation Of Heat Dissipation System For Seafloor Junction Box

Posted on:2011-09-15Degree:MasterType:Thesis
Country:ChinaCandidate:X H YuFull Text:PDF
GTID:2132360302978363Subject:Mechanical and electrical engineering
Abstract/Summary:PDF Full Text Request
As the understanding of the sea resources, environment and its strategic status in the modern society develops, Cabled Ocean Observatory System is urgently required for long-term real-time monitoring of the ocean. The stability of the Seafloor Junction Box is especially important for it's the center in the Cabled Ocean Observatory System. This thesis aims to offer a set of feasible heat dissipation scheme for the subsystems of Seafloor Junction Box and realize the project.Firstly, this thesis reviews the present research situation of the ocean electromechanical equipment's heat dissipation design and systematically elaborates the theoretical foundation of heat design and the application of computer simulation technology in the heat dissipation and therefore decides the content and techniques of this research. Because of the high power dissipation and the high temperature peak areas, we designed a special heat dissipation system by oil-filling and used an elastic component for volume compensation of thermal expansion. With this design, the temperature rise in the power vessel was successfully controlled, and the temperature gradient was decreased. Some suggestions are also given about 10KV-10KW power system. A more direct method with a dry-contact bracket was used and a special expansion device was designed to reduce the impact of vessel distortion under the high pressure. At last, a method that can improve the work condition of the camera system is introduced.This research offers a set of feasible heat dissipation scheme for the Seafloor Junction Box and it is well applied in this project and it works for the theory and project basis heat design ocean electromechanical equipment.
Keywords/Search Tags:Seafloor Junction Box, Reliability, Thermal design, Simulation
PDF Full Text Request
Related items