Preparing And Research On Conductive Particles Applied In Anisotropic Conductive Film

Coupled with the development of the IT industry, electronic product tends to be smaller, thinner and more integrated. In order to catch up with this tendency, the micro-interconnect technology is growing into an important factor of the industry.ACF (anisotropic conductive film) is a new-type micro-interconnect technology. In a relatively low temperature, the lead-free ACF could achieve a micro-interconnect within 100μm or lower. As a matter of fact, ACF has been focus as a substitute of traditional welding.The theme of this paper is to look for a proper technique that could manufacture a kind of conductive particle which could be used in ACF. It emphases on how the parameters work on affecting the properties of the particles.Through diverse experiments, we have manufactured a few kinds of particles. Granularmetric analysis and SEM have been used to analysis the samples. We have tried to theoretically discuss how the contents of monomer, medium, crosslinker affect the properties of the particles. As well we elected proper kind of dispersant which could stabilize the whole system. We have measured the properties of the particles to determine their characteristics, such as glass transition temperature and so on.Then we applied chemical plating process on the particles through different methods in ultrasound environments. Eventually we have approached a method to prepare conductive particles with ideal surfaces.Finally the paper indicates that through dispersion polymerization could the polystyrene particle been made. And the polystyrene particle with a size distribution of 3~5μm could be used in ACF. And the chemical coating process can be operated in ultrasound environment to obtain a kind of conductive particles with ideal surface.