Study Of Acoustic Levitation Grabber

With the rapid development of the electronics technology in recent years, computer technology and materials of science and technology, the scope of application of the ultrasonic sound technology is even more widely in the related industries of national economy ,this has prompted the mechanism and research of application technology of power ultrasonic technology also has made significant development. The research of ultrasonic sound technology mainly contains three areas, namely, the formation of high-power ultrasonic, the mechanism as well as the applications of power ultrasonic technology.This paper analyses the present research status and future developments of the ultrasonic suspension in current domestic and international and raises a non-contact fixture based on the effect of ultrasonic suspend directed at a typical disk part in the field of the precision machining. First basic experiments are hold in the use of the existing conditions, including ultrasonic suspend test and antifriction test, providing a theoretical foundation for next design and study.The needed experimental systems are designed and choosen, including the choice of the ultrasonic sound generatorand the the ultrasonic sound transducer, the design and make of the of ultrasonic horn and the clamp structure of ultrasonic suspension, the clamp structure can change the acoustic vibration which derived from a transducer to ultrasonic vibration in three directions thus achieving the non-contact constraints of the spatial position of the workpiece. By using finite element methods, the modal analysis and response analysis of harmony of ultrasonic clamp bodies are hold,getting the changes of amplitude versus frequency of the gripping system, and compared the gripping ability and work of the gripping bodies under different structures and encouragement and thus create the optimum gripping institutions. Finally, the results are verified by experiments.Through studies, it is feasible to make the non-contact Grabber by using the ultrasonic suspension, its advantages can be Fully displayed in the high-precision processing and precision machining and it can overcome the shortcomings of traditional clamping methods easily, it has important practical significance in developing a new gripper and transmission way, especially in the semiconductor industry, it has important applications in enhancing cleanliness of the IC wafer surface and the approved rate of products.