The Influence Of Applied Magnetic Field On Plane Magnetron Sputtering

Gradient magnetic field is introduced into the discharge space by placing a magnet below the substrate in sputtering. By such an arrangement, it becomes easier to sputter magnetic target (Fe) that leads to the deposition of magnetic films. Meanwhile, some properties of the deposited film change, compared with the case without applied magnetic field. Such variations also appear in sputtering non-magnetic targets such as Al, Cu and so on. It is found that due to external magnetic field, the aspect and brightness of the plasma and the self-bias voltage for the target changes significantly. Further measurements for the deposited films indicate that the crystallization and the deposition rate of the films also vary after the magnetic field is applied. We owe these variation to the modified distribution of magnetic field near the target surface and in the discharging space, which consequently influences the motion of charged particles in the plasma, thus leads to the variation mentioned above. A detailed measurement showed apparent thickness gradient in the film plane, which is interpreted as the result of the motion of magnetic charged particles sputtered from the target in the special- distributed magnetic field. We also found the variation of the position, width and depth of the erosion ring under the influence of the external magnetic field. Therefore, the use of the target can be improved by applying a proper magnetic field.