Properties Of Cu Film And Ti/Cu Film On Polyimide Prepared By Ion Beam Techniques

With good thermal stability, low dielectric constant, excellent chemical stability and mechanical properties, polyimide (PI) has already been widely applied in electronic packaing and microelectronics industry. With lots of potential application prospects, Cu film and Ti/Cu film prepared on PI substrate have been paid great attention by researchers. Good adhesion is basic requirement of metal films on polymer substrate for the real use, and improving adhesion of metal films is an important research item.In this work, Cu film on PI substrate was firstly prepared by ion beam sputtering technique, and combined ion implantation ion beam sputtering techniques were applied to prepare Cu film on PI substrate afterwards. During research, three-dimension white-light interfering profilometer and surface profiler were used to measure thickness of each film. X-ray diffraction (XRD), scanning Auger nanoprobe (SAN), atomic force microscopy (AFM), nano indenter, and scanning electron microscopy (SEM) were employed to study phase, depth profile, roughness, nanohardness, modulus, adhesion, and surface morphology, respectively. At the same time, AFM and SEM were used to research effects of different ion implantation on PI substrates, and the best dose of ion implantation on PI substrate was also studied.The same ion beam techniques were used to prepare Cu film and Ti/Cu film on polyester substrate. AFM, SEM, and SAN were applied to analyze surface morphology and depth profile of deposited films.The same ion beam techniques were also attempted to prepare Cu film on nickel filament with complicated shape. SEM was used to evaluate quality of Cu film on Ni filament.The results suggested that both the Cu film and Ti/Cu film were of good adhesion with polyimide substrate, and ion beam techniques were suitable to prepare thin metal film on polymer, including polyimide and polyester. Ion beam techniques were also suitable to prepare thin metal film on special metal substrates with complicated shape like Ni filament. It is also confirmed that ion implantation before film deposition does play an important role in improving adhesion of metal films.