DMAIC Problem-solving Method Used In Main Board Solding Improving Process

In the 21st century, the vast majority of the Fortune 500 companies have introduced advanced Six Sigma management approach, and achieved great results, this treatise has deeply researched optimizing study for main board sold wetting improving process on the basis of DMAIC , meanwhile combining with the requirement for actual producing.Pratices as followsFirstly we introduced the maintek computer current situation analysis, developing improvement goals.Using a variety of quality management tools such as: trends, fishbone diagram, Plato and the potential failure mode analysis, and application of measurement systems analysis methods to study the performance measurement system Using design of experimental (DOE) method: Select the center point of the full factorial experiment, using Minitab software from residual variance analysis results, and ultimately find the key input factors: solder temperature, motherboard OSP film thickness, and fitted regression equation model, to be verified, which will build on the motherboard sold process based on the use of statistical techniques significantly improved the yield rate, meet the needs of the plant.According to the result of experiment,we set the improve methods. Judging from the control run result,we make the control for key process,and using Xbar-R to control the thickness of OSP as well.This thesis also provide a template DMAIC improvement model for the local companies, and it gives an example for the board related industries to improve the welding process have reference value.