Study On Preparation And Process Of Epoxy Resin-based BMC

With the properties of high mechanical strength, good electrical insulation, antistatic, anti-leakage resistance, chemical resistance and the others, BMC is widely used in electrical components, automotive parts and electronic plastic and other fields. However, with the development of high technology, we need BMC materials with better properties, especially in mechanical, electricity and heat-resistance. The use in the electrical, construction and aerospace is restricted by the unsatisfactory properties of traditional BMC materials. Epoxy resin is used by its high temperature resistance, good corrosion resistance, good mechanical strength, good insulation, low shrinkage and low water-absorption. If we can use the unique advantages of epoxy resin, and make bulk molding plastics with epoxy, all the shortages of traditional BMC materials will be solved easily.This article is to provide a basis theory and data for the future research of epoxy resin-based BMC materials, we make the molding product by changing the formula of the fiber/filler/epoxy resin, optimizing and adjusting the parameters.We choice HMD A and E-51 epoxy resin as the matrix material, talcum powder and hollow glass beads as a filler, E-glass fiber as a reinforcing material. We find the appropriate initial viscosity from the tests of BMC molded epoxy materials prepared. Then we adjust and optimize the molding parameters by testing the mechanical strength, appearance, the flowage of molding material, the degree of curing reaction. We discuss the fiber/filler ratio of BMC Comprehensive performance, study the problem of fiber orientation in molded products, then we find the optimal formulation and properties by changing the short-cut fibers, fillers, epoxy resin mixture of three components, testing different ratios, the epoxy BMC electrical properties, mechanical properties, water absorption, shrinkage, etc.. The last result is when the glass fiber/ filler weight ratio is 35/15, forming temperature is 80℃, molding pressure is 6MPa, holding time is 60minits, the epoxy resin-based BMC shows the best mechanical properties and curing shrinkage is less than 0.5%.Finally, we study the preparing of low-density epoxy molding material, and the affect of the BMC in the density and mechanical properties. When the volume of glass beads is 8% to 20%, the density of the epoxy BMC plate significantly drops, when the addition is 20%, the density can be reduced to 0.91 g/cm3, also the tensile strength.