The Research Of Swaging Process For Preparing WCu Alloy Wire

According to the properties, such as the big difference of melting point among Pseudo-alloy elements, and with the equivalent volume, these elements are difficult to form mesophase, thereby adopting conventional technologies like drawing, extrusion; forging is hard to get alloy wire. In this paper, using loose packing infiltration method successfully obtained WCu alloy billet with large aspect ratio, and processing into wire of diameter 4mm by swaging technology. In the research, using electronic scanning, XRD methods, analyzing the Microstructure and physical properties of WCu alloy wire under different temperature and deformation, meanwhile Optimizing the WCu swaging process in the experiment. The result present:1. Using the swaging technology prepare WCu pseudo alloy wire material. The optimal process is initial temperature 700℃-750℃. Before the deformation of billet reaches 25%, the processing capacity is 0.4mm; After the 25%, the processing capacity is 0.3mm.2. Taking advantage of the swaging technology, we successfully developed the alloy wire with diameter 4mm, length 800mm, relative density 98.16%, hardness 252HV, electrical conductibility 39.2%IACS, homogeneous microstructures, clean surface.3. WCu25 billet with slenderness ratio exceeding 100 times is obtained by loosing packing infiltration. The process is putting certain amount and grain composition WCu25 mixed power into graphite mold, then giving appropriate press make the power closely contact, and adding enough supplementary copper into the sintering furnace to complete the infiltration sintering under the H2 atmosphere.4. In the appropriate deformation extent, swaging can effectively improve microstructure homogeneity, refining grain, and remove the defects like the Cu enrichment and holes in the WCu alloy. As the deformation reached 30%～40%, swaging is able to make Cu phase form detailed context and network-like closely connected structure. The electrical conductibility at every swaging temperature is increased first and then fall with the change of deformation. At Under 750℃,when the deformation reaches 50%, the Strength of WCu wire material enhance with the increase of deformation.