Simulation Of Micro EDM Deposition In Gas And Research On Its Mechanics

As a new method in the field of EDM, micro-EDM deposition (EDD) in gas is a big breakthrough in traditional manufacture. Not only it can be able to grow or modify material on defective parts, but also obtain micro three-dimensional structures with concave and convex characters, which is of great significance to the progress in the field of EDM and micro-manufacture. However, for the complexity of micro EDD in gas process, some phenomenon has beyond the ability of tradition theories and hard to be defined. We must make a further exploration of the machining theory, find out its rule and consummate the theoretical foundation. This job is not only of great significance to the consummation of micro EDD in gas theory, but also promotes the development and progress of its processing.This paper is based on the traditional EDM theory, and start with the major factors that affect the discharge corrode in EDM machining, analyze the realization condition of micro EDD in gas. Through the experiments and theoretical analysis, the bonding mechanism of micro EDD in gas is researched. A heat conduction model of micro EDD in gas is built through selecting a proper heat-source model, thermal boundary conditions and discharge channel diameter etc. With the ANSYS finite element analysis system, the transient thermal field of the tool electrode and workpiece is analyzed under single pulse, and the processing parameters range of micro EDD in gas is predicted. Further more, validate the applicability of this model in predicting the processing parameters through experiments.The computation model of continuous micro EDD in gas machining temperature field is presented. Utilize ANSYS to compute the model, and gain the temperature field of continuous discharge deposit process, analyze the result of simulation and reveal the law and character of temperature variation. Based on this result, use the points'temperature as load, and apply it to the workpiece and deposit, compute the transient thermal stress, analyze the changes and distribution of the stress field, then provide a guidance to reduce the thermal stress and avoid cracks.