Investigation On The Storage Stability And Hybrid Material Of Epoxy And Phenolic Resins

Epoxy Molding Compound (EMC), as one of the most important micro-electronics molding materials, has attracted a lot of attentions. Good storage stability and long shelf life is one of important requirements for epoxy molding compound. In this article, we focused our energy on the investigation of possible factors that may influence the storage stability.Several epoxy based blends were selected for preparation and several possible factors, including humidity, accelarator and phenolic resins, were selected for investigation on the blends'storage stability. It is found that water shows the most profound effect on the storage stability for the molding compound.In order to study the mechanism for the water (humidity) effect on the storage stability, several reaction schemes were designed. By DSC and NMR characterizations, it is found that the phenolic resins can react with the epoxy resins with the presence of water. As a result, water show the function of accelerator, which can explain the deterioration on the storage stability for epoxy resins. In order to improve the humidity resistance for epoxy resins, montmorillonite(MMT) was added into the blends of epoxy and phenolic resins due to the barrier effect offered by the nano-platelet of MMT. The optimum accelarator contents, the morphology of montmorillonite in the matrix of epoxy and phenolic resin, the water uptake ability and mechanical properties of the blends were investigated by the incorporation of montmorillonite. With the presence of MMT, it is found that the curing behaviors of the blends are quite different from the pure parts and the water uptake ability for the blends is lowered and the mechanical properties (the glass transition temperature, tensile strength and modulus) are also improved.