| In order to improve the water resistance, curing processing and brittleness of the silicate inorganic adhesive, these experiments have carried through choosing the optimization of the stuffs based on the orthogonal experiment and simple experiment. A kind of Improving silicate inorganic adhesive has been developed and the prescription is following: compound binder(compound water glass) 27.70%, quartzose powder 19.39%, alumina 22.16%, cupreous powder 13.30%, potassium titanate whisker 9.00% and distilled water 8.45%. The adhesive is easy to be solidified and technics is as follows: Placed 8～10h at room temperature and then heated up for 2h in an oven at 100～120℃. The performances of physics, chemistry, durability and mechanics of the modificatory inorganic adhesive are analyzed in this paper. The results show that the adhesive of pH value between 9 and 13 can cause the metal surface form compact Fe(OH)2 protective film, then the metal is no longer corroded; The adhesive have outstandingly waterproof and organic solvent-proof properties. The test samples have been soaked in water and organic solvent for more 3 months, but bond strength does not have obvious change. The acid-proof performance is also excellent. Although the test samples have been putted in 0.5 mol/dm3 HCl and H2SO4 for 1 month, the adhesive still have the suitable bond strength. These adhesive doesn't bear the alkali. The test samples have been only soaked in 2 mol/dm3 NaOH and saturated Ca (OH)2 for 20 30h, they are destroyed completely. There is very good heat-resisting property in the adhesive, the heat absorption peak which shows the adhesive decomposed does not appeare yet on the DTA curve at 1000℃, It means the adhesive has still the large strength at 700℃. If the load bearing is smaller, they still have the certain strength for use at 800℃. The resisting heat-shake performance of these adhesive is good, and the test samples are not destroyed after heat shocking 15 times in cold water at 600℃.The moisture evaporation rule in the adhesive solidification process is firstly described in this paper. The characteristic of concretion kinetics is also obtained. The zero order kinetics rule is followed on pre-solidification step of the silicate inorganic adhesive. The non-integer order characteristic of kinetics, however, is manifested on the solidifying step , and the orders of reaction respectively are 0.7418, 1.516, 1.584 and 1.975, moreover the speed constants are 0.01517, 0.1247, 0.1570 and 0.7568 at 35℃, 50℃, 70℃and 85℃respectively. The change rule of rate of dehydration in the adhesive solidification process can be described with the equation of x=ABt/[ Bt+10exp (-Bt) ]. Based on the predecessors'production, the adhesion mechanism has been developed through analyzing the result of this study. It is as follows: the SiO2 colloids are unceasingly separated from the solution with continuous reduction of the moisture content in the... |
PDF Full Text Request