Synthesis, Curing And Application Of Epoxy Resins Containing Phosphorus And Nitrogen

In this dissertation, several novel halogen-free fire-retardant epoxy-based copper clad laminates (CCL) were developed. Two kinds of phosphrous-containing epoxy resins (FD and ED) were synthesized by different method. A novel nitrogen-containing curing agent 2,4, 6-tri (phenol-methylene -amide)-trizone (MFP) was synthesized for preparing high-performance epoxy polymers, and the synthesis kinetics, cure kinetics and mechanism of MFP cured with DGEBA have been investigated by Differential Scanning Calorimeter (DSC) and in situ Infrared (FTIR). A new method introducing nitrogen into the epoxy resin system was explored which is similar to organic/inorganic hybird. We also investigated the CCL prepararation technics. The performances such as fire-retardancy and heat resistance of the CCL were tested. And the effects of introducing P and N into epoxy resins system on the CCL were discussed. It is proved that the prepared CCL using MFP cured with FD or ED can meet the requirements of FR-4.