Preparation And Properties Study On Encapsulating Materials Of Epoxy Resin

With the development of aviation, spsceflight, watercraft and electronics, high-performance encapsulating materials were required. It is one of the most important projects to look for a kind of encapsulating materials and research the new methods of preparing it. In this thesis, encapsulating materials of epoxy resin were prepared by using modified acid anhydride prepared ourself as curing agent, HGH,nanostructured SiO₂ modified by organic silicon coupling agent as filler. In the present investigation, the microstructure, some properties and influence factors about them have been systematically studied using electron microscopy and differential analysis measurement techniques.The modified epoxy resin materials with HG and HGH have first been preformed. Properties test results showed that the mechanical properties and electricity properties are improved by addition of HG or HGH in the epoxy resin materials, and the materials containing HG or HGH have lower linear thermal expansion coefficient compared with neat epoxy resin. When the modified materials were in water for 24 hours, the mechanical properties and electricity properties of the materials with HGH are better than that of the materials with HG.Nonostructured SiO₂ particles were dispersed efficiently in epoxy resin by ultrasonic wave and coupling agents, and epoxy resin/nanostructured SiO₂ composite materials were prepared. The microstructure and properties of the materials are studied by scanning electron microscopy and other test methods. The results indicated that the microstructure of the modified materials had the structure of nanometer materials, and the mechanical properties, heat and electricity properties of the materials were all improved by addition of nanostructured SiO₂ When the content of nanostructured SiO₂ is 3wt%, the mechanical properties of the nanometer composites were the best, impact strength is 100% higher than that of epoxy resin, flexural strength is 77% higher than that of when nanostructured SiO₂ is 0wt%.Based on the over research, tow different kinds of encapsulating materials ofepoxy resin are performed. Test results showed that the electricity properties of the encapsulating materials of epoxy resin with HGH are famously improved, but the addition of HGH, the viscosities of the epoxy resin-HGH system is higher compared with that of the others and the encapsulating process is effected. Nanostructure SiO2 improved the mechanical properties of encapsulating materials of epoxy resin, impact strength reaches 23.8kJ/m from 11.9kJ/m , flexural strength reaches 130.6MPa from 73.7MPa.The different modified epoxy resin materials have obtained better effect in practical application.