| Epoxy resin having a stable in molecular structure and a stability of the various performance in200℃is a thermosetting resin. Epoxy resin with three dimensional net structures is formed via curing crosslink reaction of cured agent and epoxy resin, having superior performance. As the distance between the molecules, form, crosslinking density of epoxy resin had changed greatly introduced the different types of curing agent, the properties of epoxy resin cured depend largely on the molecular structure of curing agent. Epoxy resin has been widely applied in electronic insulation packaging technology.In this paper, the epoxy resin electronic packaging materials were prepared with epoxy resin E-51as matrix resin, MNA as curing agent, the carboxylic-butyl rubber as toughening agents, BPO and DMP-30as curing promoting agents under100℃curing2h and120℃curing6h. The mechanical properties of the materials were characterized via tensile test,the toughness of the materials could be obviously improved by CTBN. The shear tensile strength of epoxy resin was greatly increased by joining CTBN. The micro structure of materials was observed by the scanning electron microscope, the toughness of the materials could be obviously improved by CTBN. The shear tensile strength of epoxy resin was greatly increased by joining CTBN.In IR spectra analysis, after the curing of epoxy resin material, epoxy groups disappeared, indicating that the epoxy to cure fully. And the thermodynamics properties of the material were characterized via the dynamic thermal mechanical analyzer, the brittle fracture of the materials would change into ductile fracture by the scanning electron microscope. The problem of craze materials could be solved by silver grain effects. The electrical properties of materials were characterized with high pressure electric bridge and micro electric current test,the effect of promote agent, toughening agent, and the dosage of maleic anhydride on the dielectric loss, volume resistivity, and dielectric constant of the materials were discussed, respectively. |
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