Simulation Of Glass Sheet Separation By Laser-Induced Thermal Stresses With Local Cooling

The application of cutting brittle material such as ceramic, silicon chips and glass by laser has attracted more attention folling the deepened research of cutting by laser induced stress using controlled fracture technique. In this paper, a new local cooler is set up. And we simulate the temperature and stress field distribution in the brittle material during the laser scanning process by common finite element method (CFEM) and extended finite element method (XFEM).First, symmetric cutting process is investigated,Given the laser heater's parameters, we analyzed the temperature and stress field, which influenced by the cooler's changing parameters. Thus, optimized cooler's parameters, which fit current heater, and the available margin of power-speed for continues cutting process are found. The availability of this method is validates by simulation of soda-line glass panel using CFEM. The result shows that the available margin of power-speed has been enhanced and especially, the crack propagation speeds up if a cooler is set up.Then we investigate asymmetric and curve cutting scenario by using XFEM, which avoids replot problem when analysising crack growth discretionarily in CFEM. Quarter line, quarter arc, right angleand are included in our study. an analysis of deviation under different laser paths and crack paths of different cold and heat source, and it proves the effectiveness of XFEM in analysing asymmetric cutting, and after comparing results of calculation with and without local cooling,it proves out that local cooling has little effect on the quality and precision of asymmetric cutting.