Coupling Modeling And Influence Mechanism Of Interconnection Configuration And Signal Transmission In Microwave Modules

Microwave modules are widely used in radar,communication,navigation,electronic countermeasure and other fields,and are gradually developing towards the direction of miniaturization,high frequency and high speed,high integration and high reliability.Interconnection is used for mechanical connection and electrical interaction of circuits in microwave modules.With the increasing frequency of electromagnetic transmission and density of system integration,the interconnection configuration has a rapid and significant impact on signal transmission performance.In addition,under the influence of manufacturing errors and environmental loads,interconnection configuration is prone to distortion and even defects.As a result,the signal transmission performance of microwave modules deteriorates or even fails.For this reason,in this paper,the coupling modeling of interconnection configuration and signal transmission in microwave modules and its influence mechanism are studied.The main work is as follows:1.In order to break through the long-term bottleneck that restricts the performance improvement of microwave modules,the coupling modeling theory of interconnection configuration and signal transmission in microwave modules is proposed.The basic research on the coupling theory of interconnection configuration and signal transmission is introduced.The typical characteristics of interconnection configuration and signal transmission parameters in microwave modules are analyzed,and the microwave circuit technology related to the coupling theory of interconnection configuration and signal transmission is summarized.A method for coupling modeling between interconnection configuration and signal transmission is proposed.The framework and contents of the research on the mechanism of the coupling effect between interconnection configuration and signal transmission are discussed and analyzed.2.In microwave modules,the arc-curved ribbon bonding interconnection can buffer the assembly stress and environmental load of the interconnection,which greatly improves the reliability of the interconnection.However,irregular and easily deformed ribbon bonding geometry can significantly affect the signal transmission.Therefore,for ribbon bonding interconnection,the coupling modeling between interconnection configuration and signal transmission based on equivalent circuit is studied,and the influence mechanism is analyzed.Some interconnection prototypes were made,and measurements were carried out on the GSG probe test device.The accuracy of the ribbon bonding interconnection coupling model is verified.The influence mechanism of interconnection configuration parameters and their intervals on signal transmission is analyzed,and the envelope of interconnection performance intervals considering process disturbance and configuration variation is also analyzed.Finally,the performance of signal transmission of four types of ribbon bonding interconnection is compared by simulation.3.The configuration design of complex interconnection(configuration changes in threedimensional direction)in microwave module has a dramatic impact on the signal transmission performance with the increase of frequency.This kind of interconnection is usually difficult to establish coupling model by the equivalent circuit method.Therefore,data mining-based coupling modeling between interconnection configuration and signal transmission and analysis of the influence mechanism are studied.For the ring ribbon interconnection,the coupling model is established by factor design and response surface method,and the influence mechanism of key configuration parameters and signal transmission performance is further studied.For the flexible conductor wire interconnection,a method for identifying the coupling parameters of interconnection configuration and signal transmission based on data analysis of orthogonal experimental is proposed.The coupling characteristics of interconnection configuration parameters are identified.Further,an optimal design method of experimental particle swarm optimization is proposed for interconnection.The accuracy of the above model and results is verified by simulation comparison and prototype measurement.4.In view of the lack of establishing equivalent circuits and extracting parasitic parameters of complex interconnection in the existing research,it is not possible to directly explore the influence mechanism of interconnection configuration and signal transmission through circuit models,and it is also difficult to achieve accurate performance compensation based on circuit parameters.Therefore,based on the space mapping method,the circuit equivalence and parasitic parameter extraction of single interconnections and their link system are deeply studied,and the simplified circuit models and three-dimensional structure electromagnetic fine models of ring ribbon interconnection,movable lead interconnection and their cascade link are established respectively.RLC parameters of equivalent circuits are extracted based on space mapping method,and the accuracy of equivalent circuit model and parasitic parameters extraction are verified by software simulation.Finally,a method of circuit equivalence and parasitic parameter extraction for multi-interconnection link systems is proposed,which can provide reference for multi-interconnection link analysis and performance regulation.5.The interconnection in the microwave module is subject to process fluctuations and environmental loads,which directly affects the signal transmission performance.In order to improve the stability of the interconnection development,considering the process fluctuation and thermal distortion of the interconnection,an interval prediction method for the correlation between the interconnection configuration and the signal transmission is presented based on the weighted distribution constraint method.Through experimental design and optimization analysis,the key parameters of interconnection configuration considering interaction effect are selected,the influence degree of key parameters is calculated,and the expression of available interval calculation for interconnection configuration parameters satisfying signal transmission performance index is deduced,and the predictable interval for interconnection configuration is realized.The accuracy of prediction method is verified by model simulation and experimental measurement.6.When assessing the effect of interconnection configuration on signal transmission,industry currently mainly uses commercial electromagnetic software simulation or experimental measurement.There are many problems such as heavy workload,complex operation and high cost.For this reason,based on the coupling modeling and influence mechanism of interconnection configuration and signal transmission in microwave modules,a web-based software platform for analyzing and controlling the effect mechanism of interconnection configuration and signal transmission in microwave modules is developed,which has been applied in engineering.All-round combination of quality control and performance control in the whole process of interconnection design and manufacture can be achieved.Auxiliary engineers can analyze and control the influence between interconnection configuration and signal transmission,simplify the complicated operation of electromagnetic software and experimental measurement,improve efficiency and save costs.