Structural analyses of a rigid pavement overlaying a sub-surface void

Pavement failures are very hazardous for public safety and serviceability. These failures in pavements are mainly caused by subsurface voids, cracks, and undulation at the slab-base interface. On the other hand, current structural analysis procedures for rigid pavement assume that the slab-base interface is perfectly planar and no imperfections exist in the sub-surface soil. This assumption would be violated if severe erosion were to occur due to inadequate drainage, thermal movements, and/or mechanical loading. Until now, the effect of erosion was only considered in the faulting performance model, but not with regards to transverse cracking at the mid-slab edge. In this research, the bottom up fatigue cracking potential, caused by the combined effects of wheel loading and a localized imperfection in the form of a void below the mid-slab edge, is studied. A robust stress and surface deflection analysis was also conducted to evaluate the influence of a sub-surface void on layer moduli back-calculation. Rehabilitative measures were considered, which included a study on overlay and fill remediation. A series regression of equations was proposed that provides a relationship between void size, layer moduli stiffness, and the overlay thickness required to reduce the stress to its original pre-void level. The effect of the void on 3D pavement crack propagation was also studied under a single axle load. The amplifications to the stress intensity was shown to be high but could be mitigated substantially if stiff material is used to fill the void and impede crack growth. The pavement system was modeled using the commercial finite element modeling program Abaqus RTM. More than 10,000 runs were executed to do the following analysis: stress analysis of subsurface voids, E-moduli back-calculation of base layer, pavement damage calculations of Beaumont, TX, overlay thickness estimations, and mode I crack analysis.;The results indicate that the stress and stress intensity are, on average, amplified considerably: 80% and 150%, respectively, by the presence of the void and more severe in a bonded pavement system compared to an un-bonded system.;The sub-surface void also significantly affects the layer moduli back-calculation. The equivalent moduli of the layers are reduced considerably when a sub-surface void is present. However, the results indicate the back-calculated moduli derived using surface deflection, and longitudinal stress basins did not yield equivalent layer moduli under mechanical loading; the back-calculated deflection-based moduli were larger than the stress-based moduli, leading to stress calculations that were lower than those found in the real system.