| A fundamental investigation on the evolution of microstructure in OFHC copper under high-strain, high-strain-rate deformation has been conducted. This process is essentially adiabatic, due to the very short time of deformation, and the temperature rise can significantly affect the mechanical response of the material. Copper samples were deformed to high plastic shear strains ;The effect of grain size on high-strain, high-strain-rate deformation of copper was also investigated. Copper specimens with four widely different grain sizes (9.5, 25, 117, 315 ;Constitutive description using the Johnson-Cook (ASME J. of Eng. Matls. and Tech., 103 (1981) p.201) and Zerilli-Armstrong (J. Appl. Phys., 61 (1987) p.1816) equations was carried out. It enabled the prediction of the temperature excursion as a function of the imposed strain and of the instability strain for the formation of shear band. |
