Packaging-compatible micromachined magnetic devices: Integrated passive components and modules

There are strong demands to realize miniaturized electronic products which have low profile, high efficiency, high packaging density, and low cost (reducing assembly cost and mass production through batch fabrication). For satisfying these demands, the large numbers of passive components currently used in these products should be scaled-down and integrated. To achieve these objectives, three major research areas have been categorized and performed. First, deposition methods such as electroplating and screen-printing of high quality soft magnetic materials for realizing micromachined magnetic devices are investigated. The fabricated magnetic films are characterized using in-situ measurement techniques to illustrate the usefulness of these materials in the realization of micromachined magnetic devices. Second, various inductors and transformers based on a variety of geometries, magnetic core materials, and processing techniques are proposed, designed, fabricated, and characterized using MCM-D and MCM-L techniques, micromachining techniques, electroplating techniques, and low temperature processes. These integrated micromachined magnetic components are applicable for integrated sensors, actuators, power devices, storage devices, and other micromagnetic devices. Third, a fully integrated passives module, LC filters, and switched dc to dc power converters are fabricated and tested using the realized integrated inductive components and micromachining techniques, demonstrating a range of applications for the developed materials and components.