| The power density of microchip has increased along with the rapid development in electronic technology. Cooling of electronic systems is essential in controlling the component temperature and avoiding any hot spot. Heat sinks are commonly adopted together with different technologies to enhance the cooling process. Consequently, this study proposes to improve the heat transfer performance for small scale heat sinks by investigating three alternatives.;Firstly, two different shapes of interrupted fins, elliptic and rectangular, with various gaps between the fins are examined. The parametric variations, such as gap length, and Reynolds number, are studied as well.;Secondly, there are three scenarios in heat sinks: heat transfer before the flow reaches the periodic condition; flow and heat transfer with the effect of base surface; and conjugate heat transfer inside the elliptic fins. These are parametrically determined.;Finally, the effect of vibration on the 2D and 3D small scale pin fin heat sinks are numerically studied using fluid-structure interaction (FSI) model. The two different shapes of pin fins, vibration directions, and effect of frequencies are also considered.;The results of this study can help in designing advanced heat sinks for electronics cooling by adopting the concept of interrupted, staggered, and vibrating fins. |
