| Advancements in electronic performance lead to a decrease in device size and an increase in power density. Because of these changes, current cooling mechanisms for electronic devices are beginning to be ineffective. Microchannels, with their large heat transfer surface area to volume ratio, cooled with either gas or liquid coolant, have shown some potential in adequately maintaining a safe surface temperature. By modifying the walls of the microchannel with fins, the cooling performance can be improved. Using computational fluid dynamics software, microfins placed in a staggered array on the bottom surface of a rectangular minichannel are modeled in order to optimize microstructure geometry and maximize heat transfer dissipation through convection from a heated surface. Fin geometry, dimensions, spacing, height, and material are analyzed. Correlations describing the Nusselt number and the Darcy friction factor are obtained and compared to recent studies. These correlations only apply to short fins in the laminar regime. Triangular fins with larger fin height, smaller fin width, and spacing double the fin width maximizes the number of fins in each row and yields better thermal performance. |
