The design, fabrication, and analysis of half-bridge multichip power modules (MCPMs) utilizing advanced laminate, silicon carbide, and diamond-like carbon technologies

The compilation of multiple bare die into a single package is often referred to as a multichip module (MCM). This packaging strategy has the inherent capability to significantly reduce the three-dimensional size and weight of electronics systems. This dissertation is focused on extending the packaging strategy of MCMs to encompass power electronics.; The approach has significant challenges in the realm of power packaging. Thermal and stress issues are of prime importance, requiring the detailed analysis of materials and package configurations. In the case of utilizing silicon-carbide power devices, new drive circuits are developed in this dissertation as well. Theoretical analyses are performed, circuit designs developed, power packages fabricated, and complete testing completed; all in relation to developing the packaging strategy of multichip power modules (MCPMs).