| Carbon content in TiN films produced with tetrakis(dimethylamino)titanium (TDMAT) and methylhydrazine or dimethylhydrazine can be controlled at or below 10% with a N/Ti ratio of ∼1.3 at growth temperatures between 573 and 723 K. Post-dosing either hydrazine on a CVD TiN film results in additional N-Ti bonds, indicating a surface reaction between the two precursors occurs. Co-dosing hydrazine-like compounds with larger alkyl ligands than methyl resulted in additional carbon incorporation in the TiN film.; A growth system, consisting of a load lock and growth chamber, and a precursor pyrolysis system were designed and built to study metalorganic chemical vapor deposition. Addition of a bubbler and a direct liquid injection system allowed for the vaporization of solid and liquid precursors and solutions of multiple precursors. A precursor pyrolysis system was designed for high and low vapor pressure precursors and high carrier gas flow rates. The systems were used to study (Al,Ti)N and Ir film growth.; (Al,Ti)N was used as a template to study the incorporation of elements into a multimetal chemical vapor deposited film using NH3 and a DLI solution of TDMAT and the tris(dimethylarnino)alane dimer (TDMAA) in toluene-NH 3 significantly decreases the decomposition temperature of both precursors. Carbon was reduced by increasing the NH3 partial pressure, and the Al incorporation was increased by increasing the TDMAA/TDMAT ratio in the DLI solution. Exposure to ambient resulted in significant oxygen incorporation and the removal of carbon and nitrogen from the (AI,Ti)N film. Conformal (AI,Ti)N films were produced at 450 K in the presence of NH3 and at 550 K without NH3.; The role of O2 in Ir film growth was studied with the newly designed equipment. O2 significantly decreases the decomposition temperature of (MeCp)Ir(COD) below 425 K by preventing a carbonaceous build-up on the iridium film. By decreasing the oxygen partial pressure, the island nucleation and coalescence times were significantly increased, and step coverage and roughness were improved. The iridium crystal orientation was nearly random on the SiO2 substrate and strongly (111) oriented on the TiN(111) substrate. Conformal films (step coverage ≈ 1) were produced at 550 K on both substrates. |
