| Growth in the optical telecom and datacom industries is requiting new methods of manufacture in order to increase quantities by an order of magnitude while decreasing cost. An optical manufacturing approach utilizing wafer scale optics and integration of wafer scale electronics has potential of solving some of these manufacturing issues. An optical interconnected multichip module (OIMCM) is designed and manufactured to prove the technology. This OIMCM consists of integrated CMOS photodetectors, flip-chip compatible laser array chips, high efficiency diffractive optics, and flip-chip self-alignment for precision alignment of 1–2μm. A method to design a single diffractive surface to operate over a 25nm range in wavelength, typical of the variation in a laser diode, is presented. Also of importance is operation of optical systems over a temperature range. A novel method to athermalize an optical system with a laser diode is presented which utilizes a refractive surface and diffractive surface. |
