Micro-cross-sectional lithography (muCSL(TM)): Protoyping and packaging for MEMS

In the evolving Micro Electro Mechanical Systems (MEMS) and MicroSystems Technology (MST) fields, there are two major shortcomings of device and systems development that are not being adequately addressed by current research. In order for these fields to progress into developing the next generation of devices that will be used to sense and actuate in the physical environment, microfabrication methods for rapid prototyping and manufacturing and the development of packages for MEMS are required.;Integral, or layer-by-layer, micro-stereolithography offers the most promising opportunities for rapid prototyping and manufacturing of MEMS packages, devices and microscale components. A novel microfabrication system was developed using Texas Instruments DLP(TM) technology as a dynamic mask generator and common macroscale UV curable photopolymer materials as the liquid resin for micropart generation. Microfabrication using an integral micro-stereolithography technique was demonstrated with the muCSL(TM) prototype system by creating basic single and multiple layer geometry microparts.;Characterization of the muCSL(TM) prototype system was performed using theory, modeling, analysis and testing. Results suggest that the muCSL(TM) prototype system is a viable microfabrication method for microparts with resolution in the tens of microns range. Single layer, extruded geometry was demonstrated with resolutions of less than 50mum2 and minimum layer depths of ∼12mum in size. Multiple layer geometry was demonstrated with resolutions less than 500mum2 and minimum layer depths of ∼5mum in size. Surface effects such as contact, adhesion and fracture were modeled and tested, and findings suggest that these surface forces play a role in determining the geometry that the muCSL(TM) prototype system is capable of producing. Additional research is recommended to explore methods for creating more robust multiple layer microparts using the muCSL(TM) process.