Research On The Microwave Coupling Characteristics Of TSVs And 3D Integrated Microwave Passive Filters

With the diversification of integrated circuits(ICs)applications,the semiconductor industry is facing new requirements and challenges.We hope to improve the performance of integrated circuits and to get greater integration by finding new materials and new packaging methods.To keep the Moore's Law,it is not satisfied to keep reducing the size of memory units.Three-dimensional(3D)package is an important way to increase integration,performance and heterogeneity of ICs.The 3D ICs is superior to two-dimensional flat ICs in terms of circuits'performance,volume and weight.So,the 3D ICs becomes a trend and scheme of further ICs.This technology is also recognized as the effective method to keep Moore's Law.As one of the key technologies in 3D ICs,through-silicon via(TSV)achieves vertical stacking of multi-layer chips.It has the advantages of small size,low consumption,low cost,and heterogeneous chips integration.In addition,glass interposer and through glass via(TGV)technology also provides many ideas for 3D package.In recent years,the frequency of 3D devices has increased.The signal integrity becomes increasingly prominent due to the growing coupling of high-density TSVs.Additionally,the demand for mobile communications has increased.With the advantages of small size and integration,3D passive filter causes concerns in the field of the microwave communication.In this paper,the microwave coupling characteristics of TSVs and 3D microwave passive filter are studied.Our main results as follows:1.The equivalent circuit model of high-density TSV arrays is established.The hexagonal TSV shielding cluster for smaller chip size is studied,which reduces the loss of crosstalk of TSVs.In this paper,the resistance-inductor-capacitor-conductive parameters of the TSV array are extracted in the help of our proposed equivalent loop matrix method.The?-type equivalent circuit model of the multi-ground TSV shielding cluster is established to explore the relationships of the ground-TSV distributions and the coupling parameters.Then,we proposed the optimized hexagonal TSV shielding cluster structure.By the measurements,the crosstalk of hexagonal TSV cluster is effectively reduced.Compared to the commonly-used square-type TSVs,the hexagonal TSV shielding module can effectively save the chip area of 3D microsystem.2.In order to get the characteristics of differential TSVs,the equivalent circuit model differential TSVs is established with the method of four-port network and the odd-and even-mode analysis.Based on the four-port network,the impedance and transmission constant of the G-S-S-G single-ended TSVs are extracted.Then,the characteristics of differential TSVs are calculated by analyzing the odd-and even-mode TSVs.The results above help establish the equivalent circuit model of Polymer-embedded TSVs.The differential losses of TSVs with different materials and structures are compared.The study of high-density TSV arrays can reduce interconnect noise and electromagnetic interference and ensure signal integrity in 3D ICs.3.A novel compact TSV-based 3D solenoid inductor structure is proposed.Its inductance value and quality factor are studied.In this paper,the configurable inductance model of the TSV-based inductor is established by the use of the correction factor and inductance formulas of 3D interconnects.With different physical dimensions,the inductance values of inductors are changed.At a given frequency,the proposed novel 3D inductor has the twice inductance values and greater quality factor than the traditional TSV-based 3D inductor.This research of compact 3D inductor contributes to the design of passive devices and the heterogeneous integration of 3D ICs.4.Based on the proposed compact 3D solenoid inductor and 3D interdigital capacitor structures,the LC 3D TGV-based low-pass filter is explored which can be integrated in the glass interposer.It has low loss in low-pass band and good stopband suppression.Its minimum effective area is 1.19×0.78mm~2 or 0.020×0.013?g~2.Compared to other literatures,the proposed filter has the smaller size.This 3D LC filter in glass interposer contributes to the miniaturization and integration of micro-system.5.Based on the substrate-integrated-waveguide-like structure in glass interposer,band-pass filters are designed for key millimeter waves of V-band and W-band.Considering the current typical size of the TGV technology,the bandpass filters are made based on single-and double-column TGV fences.The filtering responses are explored.The study of the 3D TGV-based substrate-integrated-waveguide-like bandpass filter is one of keys of the heterogeneous ICs integration and the filtering loss reduction.