solder joint - Globe Thesis

Keyword [solder joint] Result: 121 - 140 \| Page: 7 of 7
121.	Prognostics of solder joint reliability under vibration loading using physics of failure approach
122.	Thermo mechanical analysis of through-hole solder joint using strain partitioning method
123.	Viscoplastic finite-element simulation to predict the solder joint fatigue life of different flash memory die stacking architectures
124.	Investigation and prediction of solder joint reliability for ceramic area array packages under thermal cycling, power cycling, and vibration environments
125.	Development of microelectronics solder joint inspection system: Modal analysis, finite element modeling, and ultrasound signal processing
126.	System implementation, modeling and defects pattern recognition for flip chip solder joint inspection using laser techniques
127.	Effects of temperature and moisture on durability of low cost flip chip on board (FCOB) assemblies
128.	Solder joint reliability of plastic ball grid array (PBGA) and bottom-leaded plastic (BLP) assemblies
129.	Phase-field Method Study Of Micro Solder Joint Reliability Uder Thermo-mechano-electrical Coupling
130.	Effect Of Nickel Metallization Thickness On Microstructure And Mechanical Properties In Pb-free Micro-sized Solder Joints
131.	Research On Image Detection Of Solder Joint Defects Based On Deep Learning
132.	Research On IC Solder Joint Inspection Based On Generator Adversarial Network
133.	Research On Earphone Solder Joint Recognition And Positioning Based On Image Processing And Embedded System
134.	Research On Solder Joint Identification And Location Of Circuit Board And Identification And Classification Of Common Electronic Components
135.	Study On Interface Reaction And Reliability Of SAC/Co-P BGA Solder Joints Under Rapid Thermal Fatigue
136.	Prediction Of Solder Joint Shape Of Multiple Devices And Reliability Analysis Of Temperature Cycle For Complex Assembly
137.	Research On Fast Location And Detection Method Of PCB Solder Joint Based On Linear CCD
138.	FPGA Solder Joint Based On Improved LS-SVM Esearch On Failure Assessment Method
139.	Research Of PCB Solder Joint Defect Detection Based On Machine Vision
140.	Research On Image Processing Technology Of Microchip In Wire Bonding Machine
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