Misplace Bond Issue Study During Wire Bonding Process

Along with the modern science’s and technology’s development, the semiconductordevice and the module obtained the widespread application in the project and the trade.In our daily life’s electronic electric appliance can see his form. When semiconductorseal test, chip welding in the chip welds on the plate to plant the ball, the lead bondingcraft is the present mainstream. As a result of the market competition, does productcost’s control demand, how reduce the welding bead accurate welding in the size thechip to weld day by day the plate central committee, and is related the personnel to theequipment to request to be getting higher and higher, this article mainly aims at thecompany soldering plate’s chip welding bead welding position displacement reason toconduct the research, through the sampled data utilization experimental design, methodsand so on contrast, hoped that found optimizes equipment’s associated measures, madethe installed capacity to enhance, meets customer’s needFirst elaborates the present semiconductor profession development simply,introduced that this company’s thermo-compression ultrasonic welding’s craft, and theseal entire craft, then using analysis methods and so on fish bones chart found theinfluence welding bead displacement the primary factor, first from the equipmentwelding hardware (chopper and transducer), the ambient temperature (radiation)affected, the sampling camera (promotion) analyzed, then software which andtechnological parameter welded from the equipment (weld period, supersonic, pressure,and so on) optimized the experiment, found the influence welding bead positionprecision finally the primary cause.Further regarding the ambient temperature (radiation air position, size and so on) totransducer’s thermal deformation, causes the chopper spot relative drifting, affects thewelding bead position, obtains the data performance data analysis software through thecompany data acquisition micro equipment, carries on result which the experimentanalyzed finds needs.Through the welding process parameter’s impact analysis, through the massiveexperiments, discovers the best welding bead position precision the technological parameter combination.