Dropping Simulation Research Of Electronic Products Based On ANSYS/LS-DYNA

With the rapid development of the transportation industry,the circulation environment of the products has greatly changed.products in the circulation process will inevitably be subjected to shock,vibration and other external forces caused damage,According to the survey,there are more than 80% of the damage caused by the impact of electronic products is mainly caused by falling.The drop impact is a very complicated nonlinear dynamic response process,which has special mechanical properties,In order to ensure the safety of products in the circulation process,which requires the transport of products packaging.Reasonable transportation package design should be based on the value of the product,the traditional method of determining the fragility is to carry out destructive experiment,which will cause a lot of damage to the product,while increasing the cost of the product.Using the finite element analysis method to simulate the product circulation environment,instead of the traditional physical experiment,it is a trend to obtain the crisp value of the product.Based on the impact theory,this paper analyzes the influence of the rigidity of the drop height,the product quality,the drop posture and the impact table top on the accuracy of the experiment.Fragility is determined by the structure of the product,material and other factors determine the ability to withstand the impact of vibration caused by damage.Because the rectangular pulse represents the most severe impact environment,the rectangular pulse is used to determine the damage boundary curve of the product.The displacement time curve and acceleration time curve can be obtained by analyzing the drop impact process.In this paper,the 3D solid model of product is established by using CATIA software,and the use of CATIA software and ANSYS/LS-DYNA software universal interface,the finite element model of the product is established in the ANSYS/LS-DYNA software,and the system simulation is carried out,and the simulation results are analyzed.This paper takes the mobile phone as an example to carry on the simulation research,according to the relevant provisions of the national standards and enterprise standards,the main selection of the three typical drop pose(surface drop,edge drop and angle drop) for mobile phone drop simulation test,using the DTM module in the ANSYS/LS-DYNA finite element analysis software,which simulats the free fall of the key components of the mobile phone and the phone and the phone,the display LCD,touch screen Touch and battery and other key components,in the end, the stress contour,velocity time curve and acceleration time curve of the corresponding parts can be obtained.By comparing the test data,it can be found in the case of the back drop,the maximum stress value and the failure strength of the mobile phone touch screen are close,which is easy to cause damage,because the partial damage means the failure of the whole product,the stress value is used to determine the maximum acceleration value of the product,which is on the phone to carry out a reasonable transport packagingdesign strength indicators,to avoid excessive packaging or packaging.