The Research On Simulation And Test Of Laser Head Dropping

It has long been disturbing to the engineering practitioners to handle well with the packaging and transportation for the precision electronic products. As is commonly acknowledged that these products has the attribute of precision, fragile, sensitive to shock and press, and not allowed to be reversely installed, thus a well designed package is needed to ensure its secure delivery during all kinds of transportation, like air, ship, and truck. While we know that the main cause of failure to the products mainly lies in the shock input, which contribute almost 80 percent of the cause of the failure. Shock is a very complex dynamic response process to the input of the unit under test(UUT), and whose typically difficult to be solved due to its non-linear property. With this issue badly need to be solved engineering wise, we choose the FEA(Finite Element Analysis) software which is commonly thought as the most efficient and effective way to simulate and solve the issues like this. This kind of means has been widely used by the enterprises in the eastern countries and the Japan, which has a proven profitability in the operation of the organizations.Focused on this issue, this thesis has mainly concentrated on the package design and test for the solid-state laser head whose model number is El OB, which is a product used in the Electro Scientific Industries. We have used the FEA tools ANSYS/LS-DYNA as the main tool to simulate the whole process of the shock response of the laser head during the drop test, which has been equipped with the DAQ(Data Acquisition) hard ware and LabVIEW software provided by the NI(National Instruments) company. and the post data was post-proceeded with the Matlab software to demonstrate the feasibility of the designed package. This paper has given a way to follow during the design of the package of the precision electronic products, and also provided a theory base for the future development of packages like these products.