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Study The Key Process Of Microphotonic Integrated Chip

Posted on:2015-01-16Degree:MasterType:Thesis
Country:ChinaCandidate:H FengFull Text:PDF
GTID:2268330425993711Subject:Optics
Abstract/Summary:PDF Full Text Request
With the rapid growth of network data, the demand for broadband becomes more and more urgent. In order to meet this demand, the national strategy of "Broadband China " has entered the implementation phase, and optical fiber access is the basis of "Broadband China" national strategy. The light distribution of nodes is an important part of optical fiber access network, and the planar optical waveguide splitter is one of the most important device. The splitter device market demand is growing, and it has become one of the hotspots of the optical communications industry. The main contents as follows:(1) Study the mode field mismatch loss and misalignment loss characteristics between the waveguides and fiber. Analysis the influence of the lateral displacement, vertical spacing and alignment of factors the axial angle on the waveguides and fiber coupling loss. Using bimodal mode field matching method to optimize the transition waveguide structure, reducing the transition loss.(2) The silica optical waveguide fabricate process was investigated. Silicon dioxide films were grown by the plasma-enhanced chemical vapor deposition. The doping process of the silicon dioxide film and the influence of plasma-enhanced chemical vapor deposition process parameters on silica thin film growth rate, the refractive index and stress were investigated. The silica waveguide structure was made by lithography and etching, and the lithography process of silica waveguide based on quartz was optimized, and the influence of inductively coupled plasma process parameters on the etch rate of the silicon dioxide film was investigated. Annealing treatment of the silica waveguide was realized in the annealing furnace.(3) The splitter chip was grinded, and the splitter test system was built. Chip and glass slide were bonded by UV curing adhesive bonding, self-designed grinding fixture was used to grind chip, and the problem of edge broke during chip grinding process chipping was solved; The optical fiber-waveguide alignment system was built with self-designed chip fixture and optical fiber array (FA) fixtures.
Keywords/Search Tags:PLC, splitter, plasma-enhanced chemical vapor deposition, silica
PDF Full Text Request
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