Design And Fabicate Planer Lightwave Curite Splitter Based On Silica

With the rapid growth of network data, the demand for broadBand becomes moreand more urgent. In order to meet this demand, the national strategy of "BroadBandChina" has entered the implementation phase, and optical fiber access is the basis of"BroadBand China" national strategy. The light distribution of nodes is an importantpart of optical fiber access network, and the planar optical waveguide splitter is one ofthe most important devices. The splitter device market demand is growing, and it hasbecome one of the hotspots of the optical communications industry. The maincontents as follows:(1) The structure of splitter was simulated by Rsoft software. The influencefactors of loss were analyzed, the relationship between the insertion loss and thestructure of straight waveguide was studied, and the length of the cascade straightwaveguide was optimized. Cascade was used in1×4splitter. Cosine S-bend was usedin the curved waveguide, and the rectangular waveguide transition structure was usedin the transition zone. The simulation results show that the insertion loss of the splitterwas6.77dB, and the uniformity was0.099dB.(2) The fabrication process of silica optical waveguide was investigated. Silicondioxide film was grown by the plasma-enhanced chemical vapor deposition. Theinfluence of plasma-enhanced chemical vapor deposition and doping processparameters on the growth rate, the refractive index and stress of silica film wereinvestigated. The silica waveguide structure was made by lithography and etching.The lithography process of silica waveguide based on quartz was optimized, and theinfluence of inductively coupled plasma process parameters on the etch rate of thesilica film was investigated. Annealing treatment of the silica waveguide was realizedin the annealing furnace. The influence of annealing on the silica film properties wasinvestigated, and the annealing process was optimized. X-ray diffraction, scanningelectron microscopy, atomic force microscopy, Fourier transform infraredspectroscopy and step profiler were used to characterize silica film properties.(3) The grinding process of splitter chip was investigated, and the splitter testsystem was built. Chip and glass slide were bonded by UV curing adhesive bonding,and self-designed grinding fixture was used to grind chip, which made the problem ofedge broke during chip grinding process solved; The optical fiber-waveguide alignment system was built with self-designed chip fixture and optical fiber array (FA)fixtures.