Research On The10Gb/s Small-Form Cooled Electro-Absorption Modulated Laser Assembly

In recent years, with the rapidly increasing demand for high-definition, interactiveInternet TV (IPTV), video, high-speed Internet and3G/4G mobile backhaul, The opticalcommunication was developed for high-speed, broad bandwidth and long-reach require-ment.40G/100G DWDM equipments have been applied in backbone network and gradualseep into metropolitan area network(MAN), as well as10G-EPON (10G-Ethernet PassiveOptical Network) has been partly deployed in access network. Each leap of optical communication network is tightly depending on the development optoelectronic deivce technology,including the technology of optoelectronic integration, packaging technology and so on.10Gb/s small-form cooled electro-absorption modulated laser assembly is the keyoptoelectronic device applied high-speed optical communication system equipments. Themanufacturers and many research institutes from mainland and oversea did a lot ofresearch on these devices for their good performance, low cost, small form factor, highreliability and wide range of applications. This paper focuses on the engineeringdevelopment of the device, with the achievement that prototype of the10Gb/s small-formcooled electro-absorption modulated laser assembly has been successfully developed.In chapter one, the national and oversea research progress on the10Gb/s small-formcooled electro-absorption modulated laser assembly is introduced and its keytechnologies—packaging and cooling technologies are analyzed. Then the TO package andbox-type cooled TOSA package Used for the transmitter’s optical assembly are studied.Considering the process problems, the assembly using box-type cooled TOSA package ischosen. In chapter two, the basic structure and principles of related components about10Gb/s EML cooled TOSA is illustrated, The theoretical and numerical analysis is carriedout by simulation using the software MATLAB, which builds the foundation for thethermal and optical design of the devices. In chapter three, the requirements of the devicescompliant with the XMD-MSA multi-Source Agreement was analyzed in details. Thermaland optical design was carried out. Finally, selection of the relevant components of the assembly was done; In chapter four, the package process of the10Gb/s EML cooledassembly is outlined and a comprehensive test was given to the prototype, the resultssatisfied well with the XMD-MSA multi-Source Agreement and application requirements.