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Dual SIM Module Design Based On Infineon ULC Mobile Platform

Posted on:2010-09-24Degree:MasterType:Thesis
Country:ChinaCandidate:L YangFull Text:PDF
GTID:2248330392961929Subject:Electronics and Communications Engineering
Abstract/Summary:PDF Full Text Request
The main content of this paper is about Dual-SIM module design whichbased on Infineon’s ULC mobile platform. The discussion mainly focuses onthe implementation of a new technology named dual-PST.The Dual-SIM cell phone can be achieved by improving both hardwareand software of traditional cell phone solution. User can easily use one cellphone with two SIM cards available. The application of Dual-SIM technologyhelps people especially business man to save money in the case that CMCCholds the market.From the technical point of view,there are several solutions regardingDual-SIM. The earliest solution is to use two sets of chipset and integratethem into one cell phone cover. But such a solution has much shortage likevery high cost and power consumption,and what is more,it is not veryconvenient to take with. Another improved solution is to integrate an Analog Switch into traditional cell phone solution and switch the network manually.In this case, high rate of lost camp would be found because oflow-compatibility and unsterilized software control.Dual-SIM solution from Infineon introduces a new technology namedDual-PST for protocol stack based on the ULC solution which was alreadycome on market. By using such kind of Dual-PST technology, we can notonly achieve all the dual-SIM functions with least changes for software andhardware, but also inherits all the strongpoint from the mature ULC solutionsuch as low cost,low power consumption and high stability. So it would behighly accepted by current market. This paper will focus on howcommunication be achieved between Dual-PST and MMI.
Keywords/Search Tags:Dual-SIM phone, Subscriber Identity Module, ProtocolStack, Layer1, Test Case
PDF Full Text Request
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