Shallow Trench Isolation (sti) Etch Process Conditions

STI is used in current integrated circuit manufacturing processes to achieve device isolation.This thesis discusses the Process models of Dry Etch of 0.18um Large Scale Integrated circuit manufacture,and the effect of Process parameter in STI Process.Based on the choice of a variety of process parameters to address the STI etch depth,and etching the perspective of the issue of uniformity. In this thesis,by changing the etching rate to control the etching depth of STI and by increasing the O₂ content of the etching solution to the problem of the vertical angle.After solving the issues in the STI process by utilizing the process in the thesis,The STI isolation performance can completely meet the requirement of the 0.18um logic process mass production...