Research On Key Hardware Of The MAC Module For B3G TDD Wireless Communication System

In the B3G wireless communication system, stricter requirement on hardware platform is requested for realizing the function of different sub-modules. Appropriate hardware architecture should be choosed to implement the desired function. The hardware of MAC module in B3G TDD system includes two units, one is the high performance processing unit, the other is the physical-layer interface unit. They are both high-speed digital circuit. The package,connector and wire for high-speed digital signals are no longer transparent and expedite. Therefore, the conventional methods for low-speed digital circuit are no longer appropriate in this system, correspondingly a forseeable method which can guarantee the probability of a successful design is required. In advanced high-speed digital system, we have to utilize the signal integrality analysis tools to finish our hardware system.Based on the above considerations, on one hand,this paper describes and analyzes the hardware design of MAC module, on the other hand, several advanced methods are presented after the PCB simulation and the actual system testing. The original contribution mainly focuses on the following three spects:(1) Some effective measures based on Signal Integrality theory are introduced to enhance the signal quality after analyzing, simulating and testing the key signals of high-performance MCU and RocketIO.(2) For the PCI control logic, an effective method to aviod the dismatch of transmission data and address is presented.(3) A method of In-circuit partial reconfiguration on RocketIO attributes using MCU is also presented in this paper.All the methods above are verified and proved to be feasible. Finally, a conclusion of the whole paper is given, the advantages and disadvantages of the adopted strategies are objectively analyzed and some future works for improvement are also indicated in this part.