Thermal Analysis And Study Of High Power LED

As a kind of light emitting semiconductor device, LED (Light Emitting Diode) has been developed rapidly and applied widely in various areas with its advantages of green, energy efficient, long life, stability, rich colors and convenience. Also, it will gradually replace the existing light sources and become the next generation light source in the future. With the development of LED, high power LED is becoming more widely used in lighting. But because of the heat generated by high power LED, thermal effects cause the junction temperature rise and seriously affect the performance of high power LED.The thermal properties of high power LED are analyzed and studied in this paper. In the first, the characteristics and working principle of LED are introduced, and thermal finite element theory and principle of the analysis are showed. Secondly, forward voltage method is used to test the junction temperature of 1W high power LED, and based on the corresponding high power LED, accurate results were accessed by modeling and analysis with finite element analysis software. In order to obtain junction temperature and thermal resistance data of high power LED, the packaging materials and patterns were analyzed with finite element analysis software, and the best choice of materials and models to reduce the junction temperature have been accessed by the optimization. Then, the thermal model of high power LED package using thermoelectric cooling device or heat pipe was set up and simulated, good results were obtained. These models can effectively reduce the junction temperature. Finally, an optimization program is proposed after a type of high power LED array package had been simulated and designed.In this paper, a variety of power type LED package is simulated and optimized. The theoretical data and analysis obtained has some reference value for the actual LED device packaging and thermal management design.