| Integral additive manufacturing refers to the integrated manufacturing of electronic product structure,conductive lines and electronic components by additive manufacturing method.In specifically,a variety of additive processes are used to synchronously shape the structure and conductive lines,and embed electronic components synergistically.The manufacturing methods in nearly free manufacturing advantages and to achieve more functional structure,overturns the traditional manufacturing mode of assembly,to redefine the product design,integrate the conductive lines and electronic components into structure,sharply reduce the number of connecting,greatly simplifying the manufacturing process,provides a new way of thinking for a new generation equipment of intelligence and miniaturization.In the current research,the focus is mainly on the structure manufacturing and function realization of electronic products,and the key issues in the manufacturing process,such as the connection between the pins of electronic components and conductive lines,have not been studied.Aiming at the integral additive manufacturing process of electronic products,this paper explores the design method of pin and conductive lines connection and studies the connection performance of pin and conductive lines,so as to realize the effective connection between the pins of electronic components and conductive lines and promote the further development and application of integrated additive manufacturing electronic products technology.The main research contents include the following:(1)Based on the integral additive manufacturing process of electronic products,research was carried out on the connection method between the pins of electronic components and the conductive lines.classified the type of typical electronic pins and conductive lines,clear the conductive line manufacturing requirements,combined with the methods of pins and conductive lines of traditional electronic packaging connection and additive manufacturing technology,designed the connection methods between pin and conductive line,verified the feasibility of connection methods by test,put forward the design principle of the connection methods between pin and conductive line.(2)In order to obtain conductive lines with good signal transmission stability,studied the surface quality of injection forming conductive lines.Based on the spray forming process of conductive line with high viscosity silver pulp,defined the line horizontal profile accuracy and section profile accuracy indicators.established the horizontal profile quality and section profile quality model according to the high viscosity droplet fusion characteristics analysis,specified the relationship between the horizontal profile quality and section profile quality of injection forming conductive lines and droplets spacing,obtained the interval of droplet spacing for injection forming conducting lines with optimum surface quality.(3)Based on the design of pin and conductive line connection method and the optimal process interval of conductive line forming,carried out the bonding performance test of pin and conductive line connection,and analyzed the influence of pin and silver pulp lines crosssectional area or the interface of pin and line connection to bonding performance of pin and line connection,specified the relationship between pin and silver pulp lines cross-sectional area or the interface of pin and line connection and bonding performance of pin and line connection,obtained the prediction method of the connection failure form. |
