Design And Control Of Wafer-Level TSV Electroplating Filling Equipment

Through-silicon vias(TSV)electroplating and filling equipment is one of the core equipment in TSV manufacturing.At present,the technology of TSV electroplating filling equipment is still immature,especially in the whole wafer electroplating,there are problems such as incomplete filling,uneven distribution and difficult disassembly of the fixture.To solve the above problems,this paper designed a TSV electroplating filling equipment,including structural design,control system and pipeline system.The main content of the paper are as follows:(1)Completed the detailed design and performance simulation of important structures: Based on the overall plan of the equipment,the functions and design requirements of the main structures of the equipment were analyzed,and the design of important structures such as the shell,manipulator,tank,and pipeline were completed.And through calculation,the performance parameters and selection of important parts such as manipulator motor,cylinder,rack and pinion,threaded screw and so on are determined.The 1:1 3D modeling and assembly are realized by Solidworks software,and the kinematics simulation and strength simulation of some structures are carried out.(2)The design and three-dimensional simulation of important structures: According to the overall plan design,the function and design requirements of the infrastructure are analyzed,and the design of the housing,robot,tank,and pipelines is completed.By calculation,the performance parameters and selection of important components such as robotic motor,cylinder,gear rack,thread screw,etc.are determined.1: 1three-dimensional modeling and assembly is implemented in Solid Works software,and the partial structure performs motion simulation and intensity simulation.(3)The simulation and optimization of the flow field,temperature field and strength of the stainless steel tank were carried out: Ansys software was used to simulate the stainless steel tank,and the flow field in the tank was optimized by using the bottom porous pipe inflow method,so that the speed difference was reduced from 0.9m/s to 0.016m/s;the temperature field in the tank is optimized by patch heating,so that the temperature difference is reduced from 0.6°C to 0.15°C;The bending structure and stiffener structure are adopted to optimize the strength of the tank body,so that the temperature difference is reduced from from 0.5mm to 0.069 mm.(4)Completed the design of PLC control system and host computer:using GX Works3 software,realized the control of manipulator,liquid feeding system,heating system,waste discharge system and other modules,and realized multi-software integration through GT Designer3 software simulation.Finally,the device host computer control system is constructed through Visual Studio2015 software and C# language.Through the host computer program,the communication with the programmable controller can be realized,and the corresponding function control and program change can be realized.