Calculation And Analysis Of Temperature Action Of Large Embedded Device Under Solar Radiation

Steel structure is very sensitive to temperature variation.During the construction,deformation of steel structure is common because of temperature variation.Especially for large steel structures,it is necessary to study the distribution and variation of temperature of structure,then confirm its deformation rule.Based on the large steel embedded device of a project which is during construction as the research object,by using MIDAS GEN,a finite element analysis software,the temperature field and temperature actions were calculated and analyzed.The main work contents are as follows:(1)According to the existing research results,the calculation formula of surface temperature of large steel structures was established.Based on ECOTECT,a building performance analysis software,the solar radiation intensity value of Tianjin,the incident Angle from different moments and solar altitude were simulated.The theoretical surface temperature of embedded device at the moment of maximum solar radiation was calculated by using the calculation formula.(2)In the construction site,the temperature measurement test of part of steel structure(embedded device test model,flange,frame column steel bar)were proposed,the measured temperature values of steel structure were obtained in different time periods,different climate conditions,change rules of the structure temperature and temperature field non-uniformity were analysed;According to the test data,the calculation results of the surface temperature formula of large steel structures are verified.(3)Based on a finite element analysis software MIDAS GEN,temperature actions of the embedded device under the solar radiation were analyzed,and the numerical analysis model of the embedded device was established to simulate temperature actions of the embedded device under solar radiation,to explore the size and rules of the deformation and internal force of embedded device.The results of numerical simulation were verified based on the results of deformation monitoring test of the embedded device.Corresponding solutions to the deformation of embedded device caused by temperature were proposed.