Design And Heat Transfer Characteristics Of Thermoelectric Refrigeration Module Hot End Heat Sink

Semiconductor refrigeration is a refrigeration method based on thermoelectric phenomena,also known as thermoelectric cooling,which uses electrical energy to transfer heat by the Peltier effect.However,the thermoelectric cooling efficiency is affected by the heat dissipation conditions at the hot end,and its cooling efficiency is still at a low level.Therefore,in order to better improve the efficiency of thermoelectric cooling,it is necessary to enhance the heat dissipation effect of its hot end.In this thesis,a series of researches on the new design and parameter discussion of the conventional plate finned heat sink in the thermoelectric refrigeration module under forced air cooling is carried out.The details are as follows:The mathematical model of the hot-end heat sink of the thermoelectric cooling module is established,and the factors affecting the heat dissipation are obtained.The results show that the heat dissipation form of the heat sink is mainly heat conduction and heat convection,which is related to the heat dissipation area of the heat sink and the local convection heat transfer capacity.Two new hot end heat sinks are designed for the heat dissipation of the hot end of the thermoelectric cooling module.For the conventional plate-fin heat sink,a fin heat sink with different numbers of slots is designed.The study found that compared with other heat sinks,the middle slotted heat sink has an advantage in improving the heat dissipation performance,and the fin thickness of the middle slotted fin heat sink was analyzed.When the fin thickness is 2.5 mm,the heat dissipation effect is the most.Then,the width value of the broken groove is analyzed.When the broken groove value varies from 3 to 9 mm,the performance of the heat sink changes little,and the performance of the heat sink will weaken when it exceeds 9 mm.The results show that the heat dissipation performance of the heat sink will be weakened when the increasing effect of the local convection heat transfer capacity of the heat sink by increasing the groove value cannot be offset by the negative effect of reducing the heat dissipation area of the heat sink.A new type of sub-channel finned heat sink is designed to improve the local convection heat transfer capacity and increase the heat dissipation area.That is,a new row of fins is added between the conventional heat sink fins,which are used as turbulence generators to change the airflow pattern flowing through the fins and enhance the local convective heat transfer capacity.The results show that the thermal resistance of the new sub-channel fin-finned heat sink can be reduced by a maximum of 42.6%,and the coefficient of performance of the thermoelectric cooling module can be improved by a maximum of 22.8%.The multi-objective optimization of the heat sink is studied with the thermal resistance and mass of the finned radiator as the objective functions.The novel subchannel finned heat sink is optimized by the response surface method and genetic algorithm.The finned heat sink optimized by the method can further reduce the temperature rise in the cooling system and reduce the mass.After optimization,the thermal resistance of the finned heat sink is reduced by 2.6%,and the quality is reduced by 4.2%.