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Design Of Multi-tooth Coordination-palladium Metal Structure And Its Application In Electroless Plating

Posted on:2024-05-04Degree:MasterType:Thesis
Country:ChinaCandidate:D SunFull Text:PDF
GTID:2531307139477044Subject:Materials science and engineering
Abstract/Summary:PDF Full Text Request
Electroless Chemical Platining(ECP)is an efficient and convenient technique for preparing surface metallization of polymer and inorganic materials with high reliability and excellent economic value,which can be applied to organic light-emitting diodes,sensors,organic transistors,photovoltaic cells,and other fields.Electroplating can be divided into three steps:substrate pretreatment,preparation of catalytic layer and deposition of metal particles.This coating technique is particularly common in surface metallization,where the deposition of the corresponding metal atoms is enabled by the reaction of surface groups and the contribution of electrons by the reducing agent in the plating solution.However,the traditional chemical plating process has many problems:the substrate is easy to be corroded;the activation solution is mostly composed of precious metals and the cost is high;the plating layer and the substrate are easy to peel off from each other.This paper designs the structure of multi-dentate coordination-metal particles,regulates the outermost electron structure of catalytic metal particles,optimizes the catalytic properties of metal particles,and prepares a catalytic layer that can form a stable film on the substrate surface,revealing the influence of multi-dentate coordination-metal particle structure on the growth behavior and structural properties of the coating.are as follows:(1)A method combining ECP nickel,carbonization and coating with polydimethylsiloxane(PDMS)polymer is proposed to create a flexible and lightweight electromagnetic interference(EMI.)shielding material by placing the nickel-encapsulated carbon tube structure as a conductive material in the middle of the PDMS layer.EMI(electromagnetic interference)shielding material.The results show that the shielding effectiveness(SE)of the fabricated EMI shielding material is as high as 31.34 d B,and the shielding effectiveness is 27.5 d B cm3/g with a low reflected shielding(SER)of 1.2 d B.GPa,which has very good flexibility.(2)A multi-dentate ligand structure SAAP was designed using a reactive solution(mixture of deionized water,alcohol,KH550 and Ag NO3)and the HJG-2coating was established on the substrate surface by dip coating,brush coating and in-situ film formation to simplify the chemical plating process.The hydrolyzed silane coupling agent KH550 with Si-OH and-NH2groups on the surface can not only be attached to the substrate surface through covalent and hydrogen bonds,but also can adsorb Ag particles through Ag-N and Ag-O coordination bonds;so that the Ag particles are uniformly distributed on the substrate surface with good stability,ECP catalytic ability and selectivity.The Cu coating deposited on the substrate surface by HJ-2 solution has good crystallinity,stability and electrical properties.(3)A well-bound multi-dentate ligand MLAg structure was designed as a catalytic solution by combining ECP-Cu with ethanol,deionized water,Ag NO3,KH550 and PVA mixed catalytic solutions.The results showed that the formation of Ag-N and Ag-ligand bonds provided strong interactions between MLAg and Ag particles,and the two-phase separation structure helped to enhance the surface roughness;the introduction of PVA in AS-3 solution could improve the Ag/PB interfacial structure by forming stronger Ag/-NH2coordination bonds,with the ability to pretreat inert substrates,and the prepared ECP-Cu samples had good flexibility,electrical conductivity and good selective sizing.(4)A flexible,lightweight and low-reflection EMI shielding material was prepared by combining ECP Ni,carbonized,ECP Cu and coated PDMS polymer:Cr cotton+PDMS.due to the synergistic effect of porous structure and isolation network,the shielding performance of the prepared EMI shielding material is superior and the EMI shielding effect reaches 35.4 d B;due to the introduction of Cu layer makes the surface The compressive strength reaches 53.2 MPa and the compressive 0.8 GPa modulus.The preparation technology of this flexible conductive material has a broad application prospect and can be extended to portable communication and microelectronics as electromagnetic interference shielding material.(5)An activation solution of nickel chloride combined with PVA to catalyze copper plating simple and strong interfacial bonding to prepare copper coatings was designed.Non-precious metals are studied instead of precious metals such as Pd and Ag for catalysis.The results show that the deposition of Ni particles can play a catalytic role in the reduction of Cu2+.In summary,the design of multi-dentate ligand structure,which can regulate the outermost electronic structure of the catalyst,can be achieved to improve the metal particle/multi-dentate ligand interface structure and optimize the structural properties of the coating,which can be applied to the field of non-damaging metallization of substrate surfaces.
Keywords/Search Tags:chemical plating, flexible electromagnetic shielding materials, lightweighting, surface pretreatment, rapid film formation process, non-precious metal catalysis
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