Preparation And Properties Of Degradable Photosensitive Resin

With the proposed goal of “double carbon”,environment-friendly materials have become a hot research direction.Currently,UV curing technology is widely used in various fields and has been proved to be a green molding process.However,traditional UV-curable materials do not have degradation characteristics,which will cause serious impact on the environment and even human health.In order to solve this problem,polybutylene succinate(PBS)and polylactic acid(PLA)with good biodegradability were used as matrix in this paper,and a variety of degradation photosensitive resins were prepared by chemical means.The main work of this paper is as follows:(1)Bishydroxy-terminated polybutylene succinate(PBS-D)was prepared using bio-based monomer succinic acid and 1,4-butanediol,and then polybutylene succinate acrylate(PBS-DA)was prepared by the termination of methacrylate anhydride.It can be quickly crosslinked by UV radiation at room temperature.By adjusting the ratio of the two monomers,the cured PBS-DA resin has different crosslinking density,lower volume shrinkage rate and higher tensile strength and hardness.The shape memory performance of PBS-based photosensitive resin was verified by dynamic thermomechanical analyzer.The shape fixation ratio and shape recovery ratio of PBS-DA12 reached 96.72% and95.78%,respectively.Based on this,a kind of “electrothermal intelligent”switch was developed.In addition,alkali accelerated degradation experiments have proved that the material has a good degradation trend.(2)Hydroxy-terminated polylactic acid(PLA-D)was prepared by ringopening polymerization using bio-based monomer 1,4-butanediol and L-lactide.Then PLA-DA was prepared by methacrylic anhydride,and was then combined with methyl acrylicylated cellulose nanofibers(MCNF)with different contents.The results showed that the addition of MCNF changed the brittleness of the PLA-based photosensitive resin and inhibited the thermal decomposition of the material below 200 ℃.The dielectric constant of 0.75 wt% composites increased by about 1.72 times,and the dielectric loss was lower than 0.2.In addition,it has been proved that the material has good biodegradability through soil embedding experiments,so it is expected to be used as an environmentfriendly all-polymer dielectric.(3)Different compositions of PLA-DA/POSS composite resins were prepared by using biodegradable PLA-based photosensitive resin as matrix and adding reactive MAP-POSS after UV curing.The materials exhibits hydrophobic properties,and the more MAP-POSS added,the lower the water swelling behavior.In addition,MAP-POSS can play the role of crosslinking agent in the curing process,improving the brittleness and thermal stability of resin.In addition,the addition of MAP-POSS increases the transmittivity of the material from 85% to 92.3%,which is expected to be used as an environmentally friendly transparent packaging material to meet the potential shopping needs of consumers and further promote the sustainable development of economy and environment.