Study On The Ductility Of Copper Electroplating In Printed Circuits Control By Organic Additives

With the rapid development of the electronic information industry,and the increasing miniaturization and slimming of electronic products,the closely related printed circuit board manufacturing technology is facing potential crises and new challenges.Copper electroplating,as a key technology to achieve electrical interconnection in printed circuit boards,faces a major challenge in maintaining the reliability of interlayer interconnect structures while improving the stability of the electroplated copper coating quality on increasingly high integration printed circuit boards.In the contemporary acid copper sulfate plating solution system,the deposition of copper can be effectively regulated by adjusting the concentration and combination of additives to obtain a coating with excellent ductility,improve the reliability of printed circuit boards,and extend their service life.This article mainly focuses on the effect of additives on the ductility of copper electroplating coatings in acid copper sulfate plating technology.Firstly,the electroplating tank used in this series of experiments was designed,and organic additives and phthalocyanines were studied as research objects.Through electrochemical testing and analysis of the functional characteristics of electroplating additives,the effect of additive concentration on the thickness,roughness,surface morphology,crystal orientation and ductility of copper electroplating coatings was studied.The specific research content is as follows:(1)According to the test standards and requirements,the copper plating experimental device is designed,which has the advantages of cost saving,accurate experiment,high efficiency and simple operation,and the prepared copper plating layer has high stability and uniform plating.(2)Through electrochemical performance testing,it was determined that SA-50 and PE-50 have acceleration and inhibition effects,respectively,in the through-hole copper electroplating additive system.Combined with observation of the surface morphology of the copper plating layer,when the concentrations of SA-50 and PE-50 are high,the electroplated copper coating obtained has low roughness and small crystal size,with good surface morphology.The elongation of the copper electroplating coating increase first and then decrease with the increase of the concentrations of SA-50 and PE-50,and the copper coating has high elongation rate when the concentration of SA-50 is 1.3 m L/L and the concentration of PE-50 is 12 m L/L.(3)By electrochemical performance testing,it was found that PA-100 and PI-200 have inhibition effects,while SQ-100 has an acceleration effect in the blind hole copper electroplating additive system.An orthogonal experiment was designed,and the impact sequence of the performance of the copper electroplating coating was obtained through range and variance analysis: SQ-100 > PA-100 > PI-200.By choosing the concentration of SQ-100 as a priority and rationally matching the concentration of PA-100 and PI-200,a good surface morphology and high elongation rate of the copper electroplating coating can be obtained.(4)Through electrochemical performance testing,it was found that phthalocyanine,as an additive,has an inhibition effect in the acid copper sulfate electroplating solution system.With the increase of phthalocyanine concentration,the electroplated throughhole coating is uniform,the surface morphology of the electroplated copper coating is good and the elongation rate is high.A good and stable comprehensive performance of the electroplated copper coating can be obtained when the concentration of phthalocyanine is between 1.4 mg/L to 2.2 mg/L.