Research On The Interconnection Process And Reliability Of Gold Ribbon Of Microwave RF Coaxial Connector Based On Micro Resistance Weldin

Driven by performance requirements such as miniaturization,multi-function,high frequency,light weight and high reliability,the assembly space of aerospace microwave components is narrow and the interconnection pitch is reduced.Traditional manual soldered joints is easy to crack under high and low temperature cyclic thermal stress due to the mismatch of thermal expansion coefficients between materials.There is an urgent need to develop a new type of interconnection process between the microwave terminal and the microstrip board.In this paper,micro-resistance weldingand a flexible structure is used to realize the electrical interconnection between homogeneous gold layers,and the structure and assembly welding process are studied in detail.In this paper,the orthogonal analysis method is used to design the experimental combination of the micro-resistance welding process parameters.To obtain the optimal welding parameters,we analyzed the influence of each parameter by its tensile test result.Combining the analysis of micro-resistance welding mechanism and metallographic structure,it is demonstrated that the tensile test can determine the quality of the solder joint.Through the finite element simulation and high and low temperature experiments,the influence of the shape of the gold ribbon interconnection on the microwave performance and the high and low temperature thermal stress conditions are studied,which provides theoretical support for the structural morphology and reliability analysis of the gold ribbon interconnection.The research results shows that the optimal welding parameters of the gold strip of the microstrip line are F=40oz F,U=0.70 V,t=27ms;The optimal welding parameters of the gold strip of the RF coaxial connector terminal are F=50oz F,U=0.95 V,t=23ms.Three different pull-off phenomena characterize the different processes of micro-resistance welding.The closer the gold strap is to the top of the RF coaxial electrical connector terminal.The gold strap is looser,and the microwave transmission performance is worse.The width and thickness of the gold ribbon does not much affect the microwave performance.The maximum equivalent stress of the gold ribbon interconnect structure appears at the corners of the micro strip wire bonding point.The maximum equivalent stress value on the gold ribbon is much lower than the tensile strength of the gold ribbon.The gold strip specification and the gold strip welding position does not much affect on the maximum equivalent stress at high and low temperatures...