Research On Key Technology Of Elliptical Ultrasonic Polishing Of Single Crystal Silicon

With the development of society and the progress of science and technology,monocrystalline silicon material is widely used in the manufacture of solar cells and integrated circuit boards because of its excellent performance.However,this kind of material has the disadvantages of high hardness and brittleness,and it is easy to fracture in the process of processing.Therefore,scholars all over the world have carried out a lot of research.As a new type of polishing technology,elliptical ultrasonic vibration assisted polishing has the advantages that ordinary polishing is difficult to have.It is extremely suitable for machining hard and brittle materials such as monocrystalline silicon.Based on the traditional polishing and one-dimensional ultrasonic polishing,the elliptical ultrasonic polishing is proposed in this paper.Through the design and optimization of the elliptical ultrasonic horn,the elliptical ultrasonic vibration of radial bending and axial stretching is realized at the end of the horn,and the material removal mechanism under the elliptical ultrasonic polishing is studied,The process of single abrasive ultrasonic polishing is simulated by ABAQUS software,and the influence of different ultrasonic dimensions and process parameters on the polishing process is obtained.(1)According to the principle of mass imbalance,the elliptical ultrasonic horn is designed based on the stepped horn,with the amplification factor and resonance frequency as the optimization objectives.The modal analysis and harmonic response analysis of the horn are carried out by ABAQUS software.Finally,the elliptical ultrasonic horn composed of radial bending vibration and axial stretching vibration is realized.(2)In different dimensions of the ultrasonic bibliography field,there are different instances of speed and growth in the clock.The trajectory equations of abrasive particles with different ultrasonic dimensions are established,and the trajectory simulation is carried out by using MATLAB software.The motion trajectory,existing form and effective number of abrasive particles in the polishing process are explored,and the material removal rate models of single abrasive particle and multiple abrasive particles are established.(3)Abrasives have great influence on the polishing process in different states.ABAQUS software is used to study the impact effect of single abrasives on the surface material of workpiece under different particle sizes and impact speeds.The changes of stress,strain and energy of abrasives in the polishing process are compared and analyzed,and the material removal mode under elliptical ultrasonic vibration is determined.(4)Based on the analysis of abrasive impact scratch behavior,the simulation model of ultrasonic polishing is established,and the simulation experiments of ultrasonic polishing process under different dimensions are carried out by using ABAQUS software.In order to analyze the influence of different process parameters on the surface quality of workpiece,the removal behavior of abrasive particles on the workpiece surface was compared and analyzed under different process parameters.