Research On Ultrasonic Assisted Low Damage Plane Machining Of Aluminum Matrix Composites

Silicon carbide particle reinforced aluminum matrix composite(SiCp/Al)have excellent properties,such as high specific strength and specific modulus,high temperature resistance,wear resistance,fatigue resistance,small thermal expansion coefficient and good dimensional stability.Therefore,the material has been widely used in many important fields such as aerospace and electronics industry.However,due to the different mechanical and physical properties of silicon carbide particles and aluminum alloy matrix,it is easy to produce a lot of processing damage on the surface of the material by traditional processing technology,which seriously affects the performance of the product.Therefore,it has very important theoretical and practical significance to study the low damage processing technology.This paper aims at the problem that high volume fraction SiCp/Al composites are difficult to process,and there are a lot of machining damage on the surface after machining,On the basis of summarizing the relevant research results of domestic and foreign scholars,the related theoretical analysis and experimental research are carried out around the goal of realizing the low-damage plane machining of high volume fraction SiCp/Al composites,which provides a theoretical basis for the suppression of machining damage,and finally explore the suitable processing technology and parameter range to realize the low damage processing of this material through the processing technology test,which provides process reference for the practical processing and application of this material.The specific research contents are as follows:(1)Theoretical analysis of ultrasonic assisted grinding.The kinematics trajectory of tool in ultrasonic assisted grinding was analyzed to determine the actual cutting trajectory of abrasive particles.The influence of ultrasonic vibration on the machining process was analyzed through comparative machining experiments,and the possibility of using ultrasonic assisted grinding technology to realize low damage plane machining of SiCp/Al composites was explored.According to the analysis results,a reasonable evaluation index of surface machining quality was established.(2)Reveal the material removal mechanism in ultrasonic assisted grinding process.Based on the theoretical analysis of ultrasonic assisted grinding,the actual interaction mechanism between diamond abrasive grains and material was studied through ultrasonic assisted cutting test,and the material removal mechanism under ultrasonic assisted grinding was revealed,which provided a theoretical basis for the suppression of machining damage.(3)Experimental study on ultrasonic assisted low damage plane machining of SiCp/Al composites.The influence of cutting parameters on cutting force,cutting temperature and surface machining quality was analyzed through ultrasonic assisted grinding process experiment,and the reasonable parameter range for SiCp/Al composite ultrasonic assisted low damage plane machining was clarified,which provided process reference for practical machining.