The Research On Electrochemical Additive Manufacturing Process Of Microstructures

Electrochemical deposition is a non-contact,non-thermal effect micro-nano additive technology,which has broad application prospects in high-tech fields such as modern medicine and semiconductors.The existing electrodeposition technology has the problems of complex fabrication process,long cycle and expensive equipment.In this paper,a tiny electrode platinum wire is used as the anode,and the side of the electrode is insulated by glass tube and epoxy resin.The position of anode and cathode was controlled by three coordinate stage to realize localized electrodeposition of copper,and the effect of different process parameters on the microstructure of deposited copper was studied.(1)The theory of metal electrochemical deposition was discussed,and an electrochemical additive manufacturing experimental system was established.The process of metal electrodeposition,including liquid mass transfer,preconversion,charge transfer and electrocrystallization,was introduced.The built test system mainly consists of electrodeposition system,motion control system,testing equipment and auxiliary equipment.(2)The electric field distribution of electrodeposition was analyzed.Using COMSOL finite element software,two plane physical models of platinum wire insulated and uninsulated were established to analyze the electric field distribution in different deposition stages.Simulations show that the sides of the platinum wire were insulated both at the initial stage of deposition and during the deposition process,which can improve the electric field dispersion problem and improve the localization of deposition.(3)The localized electrodeposition of metal microstructure was carried out on the experimental platform.Electrodeposition was performed using a 100μm platinum wire as the anode.Then,the platinum wire was put into the glass tube,and the process parameters such as current size,anode moving speed,sulfuric acid content,and platinum wire diameter were changed to carry out localized electrodeposition.The results show that the side of the platinum wire is not insulated,although copper pillars can be deposited,but the bottom cathode will be covered with a layer of copper.The side of the platinum wire is insulation,which can effectively improve the localization of deposition.The larger the machining current,the thicker the deposited copper pillars and the worse the localization.The faster the anode moves,the thinner the copper pillars are deposited.Under a suitable sulfuric acid content,the deposited copper pillars are relatively uniform;Copper pillars can also be deposited on copper-based and aluminum-based substrates.However,copper-based and aluminum-based are not easy to polish,and aluminum is prone to oxidation reaction,and copper can react with sulfuric acid in the electrolyte,which affects the deposition quality.The copper column with diameter of 30μm was deposited by 30μm pt wire at a current of 20 m A.