Research On 3D Microstructure Of Glass Based On Ultrafast Laser

With the increasing miniaturization of electronic devices and optical devices,there is growing demand for preparation of components of high precision and quality.However,traditional processing methods are rather struggle to meet the requirements.Ultrafast laser-based glass microstructure machining offers numerous advantages,including the ability to shape arbitrary three-dimensional structures,and high-resolution processing.The glass itself also has the advantages of low cost,high transmittance,low dielectric loss,etc.,which fosters the growing application of glass microstructure in the field of electronics and optics.This thesis focuses on ultrafine laser preparation of glass three-dimensional microstructure.It explores the influence of laser parameters on integrity,uniformity,circularity,taper,and roughness of the glass microstructures prepared.Furthermore,the application of glass microstructure in the field of optics and electronics is examined.When applying ultrafast laser to AF32 glass,the modification threshold of it is determined to be 8 μJ-9 μJ by direct observation.The influence of laser parameters on the modified region is investigated.The results indicate that the modified region area initially increases and then stabilizes with the increase of pulse energy.The modified area decreases as the pulse width increases,and increases slightly with the increase of the number of pulses.By setting different pulse energy gradients,it is observed that the through-hole structure cannot be formed when the pulse energy is below 25μJ.In the pulse energy range of 25 μJ-35 μJ,the uniformity of the through-hole is compromised due to laser energy fluctuations.The through-hole structure tend to rupture if the pulse energy exceeds 50 μJ.Additionally,when the number of pulses exceeds 1,the circularity of the through-hole reduces.Ultimately,it is determined that through-hole prepared by ultrafast laser meet the requirements of integrity,uniformity,and roundness under the pulse energy of 40 μJ-45 μJ,pulse width of 10 ps,and single pulse.In our attempt to reduce the through-hole taper,the influence of ultrasonic power and HF solution concentration was investigated.Utilizing the ultrasonic power of 120 W and 4%HF solution,a 40μm through-hole was prepared on 500 μm AF32 glass with taper of only 2.27°.Also,it is found that the roundness of through-hole decreases with the decrease of HF solution concentration.On the basis of the forementioned laser parameters and corrosion parameters,other microstructures with complete structures are successfully fabricated.In terms of microstructure applications,a novel fabrication method of atomic bubble is proposed in this study.The cavity and semicircular blind groove structures are successfully fabricated by the preparation method discussed above.At the same time,the atomic bubble is also fabricated by combining laser bonding.A kind of foldable glass that can be used for the display back of foldable mobile phones is designed.Through the design of the folding area graph and parameter optimization,the foldable glass can achieve a folding angle of 180°and withstand 210,000 times folding fatigue test when W1 is 90 μm.